分布式制造模式下的3D打印方法、装置和电子设备

School Sign:

中国科学技术大学

Disigner of the Invention:

林秋满,陈荣莹

Type of Patent:

Invent

State of Patent:

Pending patent

Application Number:

CN202310041837.X

Number of Inventors:

3

Service Invention or Not:

no

Application Date:

2023/01/11

Publication Date:

2023/05/02

First Author:

刘林冬