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由第一电子设备执行的合作方案推荐方法及设备

Release time:2024/03/04
Hits:
School Sign:
中国科学技术大学
Disigner of the Invention:
刘林冬,李宜福
Type of Patent:
Invent
State of Patent:
Pending patent
Application Number:
CN202310066944.8
Number of Inventors:
3
Service Invention or Not:
no
Application Date:
2023/01/12
Publication Date:
2023/04/21
First Author:
李胜

Attachments:

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